Atmospheric Environment Aligner "EG-303 Series"
Edge grip type aligner that does not contact the back surface of the wafer for 300mm wafers.
■High-precision centering with edge grip method using three movable claws ■Minimization of robot waiting time during alignment with optional buffer port *For more details, please refer to the PDF document or feel free to contact us.
- 企業：ダイヘン
- 価格：Other
